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  ds26ls32ac , ds26ls32c , ds26ls32m , ds26ls33m www.ti.com snls352c ? may 1999 ? revised february 2013 ds26ls32ac/ds26ls32c/ds26ls32m/ds26ls33m quad differential line receivers check for samples: ds26ls32ac , ds26ls32c , ds26ls32m , ds26ls33m 1 features description the ds26ls32 and ds26ls32a are quad differential 2 ? high differential or common-mode input line receivers designed to meet the rs-422, rs-423 voltage ranges of 7v on the ds26ls32 and and federal standards 1020 and 1030 for balanced ds26ls32a and 15v on the ds26ls33 and unbalanced digital data transmission. ? 0.2v sensitivity over the input voltage range the ds26ls32 and ds26ls32a have an input on the ds26ls32 and ds26ls32a, 0.5v sensitivity of 200 mv over the input voltage range of sensitivity on the ds26ls33 7v and the ds26ls33 has an input sensitivity of ? ds26ls32 and ds26ls32a meet all 500 mv over the input voltage range of 15v. requirements of rs-422 and rs-423 the ds26ls32a differs in function from the popular ? 6k minimum input impedance ds26ls32 and ds26ls33 in that input pull-up and ? 100 mv input hysteresis on the ds26ls32 and pull-down resistors are included which prevent output ds26ls32a, 200 mv on the ds26ls33 oscillation on unused channels. ? operation from a single 5v supply each version provides an enable and disable function common to all four receivers and features tri-state ? tri-state outputs, with choice of outputs with 8 ma sink capability. constructed using complementary output enables for receiving low power schottky processing, these devices are directly onto a data bus available over the full military and commercial operating temperature ranges. logic diagram 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 1999 ? 2013, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
ds26ls32ac , ds26ls32c , ds26ls32m , ds26ls33m snls352c ? may 1999 ? revised february 2013 www.ti.com connection diagram for complete military product specifications, refer to the appropriate smd or mds. figure 1. dual-in-line package (top view) d package or nfg0016e package figure 2. 20-lead ceramic leadless chip carrier truth table (1) enable enable input output 0 1 x hi-z see note below. (2) v id v th (max) 1 v id v th (min) 0 (1) hi-z = tri-state (2) note: input conditions may be any combination not defined for enable and enable . 2 submit documentation feedback copyright ? 1999 ? 2013, texas instruments incorporated product folder links: ds26ls32ac ds26ls32c ds26ls32m ds26ls33m
ds26ls32ac , ds26ls32c , ds26ls32m , ds26ls33m www.ti.com snls352c ? may 1999 ? revised february 2013 these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. absolute maximum ratings (1) (2) supply voltage 7v common-mode range 25v differential input voltage 25v enable voltage 7v output sink current 50 ma maximum power dissipation (3) at 25 c cavity package 1433 mw molded dip package 1362 mw soic package (4) ds26ls32 1002 mw ds26ls32a 1051 mw storage temperature range ? 65 c to +165 c lead temperature (soldering, 4 seconds) 260 c (1) ? absolute maximum ratings ? are those values beyond which the safety of the device cannot be guaranteed. they are not meant to imply that the device should be operated at these limits. the table of ? electrical characteristics ? provides conditions for actual device operation. (2) if military/aerospace specified devices are required, please contact the ti sales office/distributors for availability and specifications. (3) derate cavity package 9.6 mw/ c above 25 c; derate molded dip package 10.9 mw/ c above 25 c. (4) derate soic package 8.01 mw/ c for ds26ls32 8.41 mw/ c for ds26ls32a operating conditions min max units supply voltage, (v cc ) ds26ls32m, ds26ls33m (mil) 4.5 5.5 v ds26ls32c, ds26ls32ac (coml) 4.75 5.25 v temperature, (t a ) ds26ls32m, ds26ls33m (mil) ? 55 +125 c ds26ls32c, ds26ls32ac (coml) 0 +70 c electrical characteristics (1) (2) (3) over the operating temperature range unless otherwise specified symbol parameter conditions min typ max units v th differential input voltage v out = v oh or ds26ls32, ds26ls32a, ? 7v v cm +7v ? 0.2 0.07 0.2 v v ol ds26ls33, ds26ls33a, ? 15v v cm +15v ? 0.5 0.14 0.5 v r in input resistance ? 15v v cm +15v (one input ac gnd) 6.0 8.5 k i in input current (under v in = 15v, other input ? 15v v in +15v 2.3 ma test) v in = ? 15v, other input ? 15v v in +15v ? 2.8 ma v oh output high voltage v cc = min, v in = 1v, commercial 2.7 4.2 v v enable = 0.8v, i oh = ? 440 a military 2.5 4.2 v v ol output low voltage v cc = min, v in = ? 1v, i ol = 4 ma 0.4 v v enable = 0.8v i ol = 8 ma 0.45 v v il enable low voltage 0.8 v v ih enable high voltage 2.0 v v i enable clamp voltage v cc = min, i in = ? 18 ma ? 1.5 v (1) all currents into device pins are shown as positive, all currents out of device pins are shown as negative, all voltages are referenced to ground, unless otherwise specified. all values shown as max or min are so classified on absolute value basis. (2) all typical values are v cc = 5v, t a = 25 c. (3) only one output at a time should be shorted. copyright ? 1999 ? 2013, texas instruments incorporated submit documentation feedback 3 product folder links: ds26ls32ac ds26ls32c ds26ls32m ds26ls33m
ds26ls32ac , ds26ls32c , ds26ls32m , ds26ls33m snls352c ? may 1999 ? revised february 2013 www.ti.com electrical characteristics (1) (2) (3) (continued) over the operating temperature range unless otherwise specified symbol parameter conditions min typ max units i o off-state (high v cc = max v o = 2.4v 20 a impedance) output v o = 0.4v ? 20 a current i il enable low current v in = 0.4v ? 0.36 ma i ih enable high current v in = 2.7v 20 a i sc output short-circuit v o = 0v, v cc = max, v in = 1v ? 15 ? 85 ma current i cc power supply current v cc = max, all v in = gnd, ds26ls32, ds26ls32a 52 70 ma outputs disabled ds26ls33, ds26ls33a 57 80 ma i i input high current v in = 5.5v 100 a v hyst input hysteresis t a = 25 c, v cc = 5v, ds26ls32, ds26s32a 100 mv v cm = 0v ds26ls33, ds26ls33a 200 mv switching characteristics v cc = 5v, t a = 25 c ds26ls32/ds26ls33 ds26ls32a/ds26ls33a symbol parameter conditions units min typ max min typ max t plh input to output c l = 15 pf 17 25 23 35 ns t phl 17 25 23 35 ns t lz enable to output c l = 5 pf 20 30 15 30 ns t hz 15 22 20 25 ns t zl enable to output c l = 15 pf 15 22 14 22 ns t zh 15 22 15 22 ns ac test circuit and switching time waveforms figure 3. load test circuit for tri-state outputs 4 submit documentation feedback copyright ? 1999 ? 2013, texas instruments incorporated product folder links: ds26ls32ac ds26ls32c ds26ls32m ds26ls33m
ds26ls32ac , ds26ls32c , ds26ls32m , ds26ls33m www.ti.com snls352c ? may 1999 ? revised february 2013 diagram shown for enable low. pulse generator for all pulses: rate = 1.0 mhz; z o = 50 ; t r 6 ns; t f 6.0 ns. figure 4. propagation delay s1 and s2 of load circuit are closed except where shown. pulse generator for all pulses: rate = 1.0 mhz; z o = 50 ; t r 6 ns; t f 6.0 ns. figure 5. enable and disable times typical applications figure 6. two-wire balanced interface ? rs-422 figure 7. single wire with driver ground reference ? rs-423 copyright ? 1999 ? 2013, texas instruments incorporated submit documentation feedback 5 product folder links: ds26ls32ac ds26ls32c ds26ls32m ds26ls33m
ds26ls32ac , ds26ls32c , ds26ls32m , ds26ls33m snls352c ? may 1999 ? revised february 2013 www.ti.com revision history changes from revision b (february 2013) to revision c page ? changed layout of national data sheet to ti format ............................................................................................................ 5 6 submit documentation feedback copyright ? 1999 ? 2013, texas instruments incorporated product folder links: ds26ls32ac ds26ls32c ds26ls32m ds26ls33m
package option addendum www.ti.com 9-mar-2016 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples am26ls32cn nrnd pdip nfg 16 25 tbd call ti call ti 0 to 70 ds26ls32cn am26ls32pc nrnd pdip nfg 16 25 tbd call ti call ti 0 to 70 ds26ls32cn ds26ls32acm lifebuy soic d 16 48 tbd call ti call ti 0 to 70 ds26ls32 acm ds26ls32acm/nopb active soic d 16 48 green (rohs & no sb/br) cu sn level-1-260c-unlim 0 to 70 ds26ls32 acm ds26ls32acmx lifebuy soic d 16 2500 tbd call ti call ti 0 to 70 ds26ls32 acm ds26ls32acmx/nopb active soic d 16 2500 green (rohs & no sb/br) cu sn level-1-260c-unlim 0 to 70 ds26ls32 acm ds26ls32acn lifebuy pdip nfg 16 25 tbd call ti call ti 0 to 70 ds26ls32acn ds26ls32acn/nopb lifebuy pdip nfg 16 25 pb-free (rohs) cu sn level-1-na-unlim 0 to 70 ds26ls32acn ds26ls32cm lifebuy soic d 16 48 tbd call ti call ti 0 to 70 ds26ls32cm ds26ls32cm/nopb active soic d 16 48 green (rohs & no sb/br) cu sn level-1-260c-unlim 0 to 70 ds26ls32cm ds26ls32cmx lifebuy soic d 16 2500 tbd call ti call ti 0 to 70 ds26ls32cm ds26ls32cmx/nopb active soic d 16 2500 green (rohs & no sb/br) cu sn level-1-260c-unlim 0 to 70 ds26ls32cm ds26ls32cn lifebuy pdip nfg 16 25 tbd call ti call ti 0 to 70 ds26ls32cn ds26ls32cn/nopb lifebuy pdip nfg 16 25 pb-free (rohs) sn level-1-na-unlim 0 to 70 ds26ls32cn (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes.
package option addendum www.ti.com 9-mar-2016 addendum-page 2 pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant ds26ls32acmx soic d 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 q1 ds26ls32acmx/nopb soic d 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 q1 ds26ls32cmx soic d 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 q1 ds26ls32cmx/nopb soic d 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 q1 package materials information www.ti.com 26-mar-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) ds26ls32acmx soic d 16 2500 367.0 367.0 35.0 ds26ls32acmx/nopb soic d 16 2500 367.0 367.0 35.0 ds26ls32cmx soic d 16 2500 367.0 367.0 35.0 ds26ls32cmx/nopb soic d 16 2500 367.0 367.0 35.0 package materials information www.ti.com 26-mar-2013 pack materials-page 2
mechanical da t a n0016e www .ti.com n 1 6 e ( r e v g )

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? 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s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? 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